WECOBA® D
COPPER ALLOY WITH BERYLLIUM
The combination of high strength high thermal conductivity and high thermal stability makes WECOBA® D suitable for highly loaded current-carrying components. This low-alloy copper material is widely used in resistance welding and aluminium die casting applications where extended service life contributes to reduced overall operating costs.
RESISTANCE WELDING | ELECTRODES | ALUMINIUM DIE CASTING | CRUCIBLES/MOULDS METAL CASTING
Key Features
Balanced combination of mechanical and physical properties
High electrical and thermal conductivity
High strength and hardness
High thermal stability at elevated temperatures
Very high creep resistance
Chemical Composition nominal
Deviations may occur to achieve specific product characteristics.
Co COBALT | Ni NICKEL | Be BERYLLIUM | OTHERS | Cu COPPER |
1.0 | 1.0 | 0.5 | max. 0.5 | balance |
EN | DIN | UNS | RWMA |
CW103C CuCo1Ni1Be | ~2.1285 | ~C17500 | Class 3 |
Typical Application
Resistance Welding
Foundry technology and metallurgy
Typical Components
Electrodes and holders for spot, seam, butt and projection welding
Hot runner nozzles
Plunger tips aluminium die casting
Moulds and cooling plates
Physical and Mechanical Properties nominal
|
| FORGED | EXTRUDED |
Tensile strength Rm | (MPa) | 680 | 790 |
Yield strength RP0.2 | (MPa) | 540 | 598 |
Brinell hardness | (10/1000) | 240 | 240 |
Elongation A5 | (%) | 12 | 12 |
Elasticity modulus E | (GPa) | 135 | 135 |
Density ρ | (g/cm³) | 8.9 |
|
Thermal conductivity λ- 20°C | (W/m.K) | 232 |
|
Electrical conductivity- 20°C | (% I.A.C.S.) | 58 |
|
Electrical conductivity | (m/W*mm2) | 29 |
|
Coefficient of thermal expansion α | (10-6/K) | 17.2 |
|
The values provided are based on experience gained from production facilities, material manufacturers and our own investigations. They may vary due to production- and batch-related influences and therefore do not constitute a guarantee or a warranted property. For the evaluation of specific applications, we are pleased to provide support upon request. Binding statements or commitments are issued exclusively in written form by our technical team. Rev. 02/2026
