WECOBA® B
COPPER ALLOY WITH BERYLLIUM
WECOBA® B is a high-performance copper material suitable for precipitation hardening. This process provides high strength, hardness and wear resistance. The combination of high tensile strength, good electrical conductivity, a high modulus of elasticity and excellent fatigue strength supports its use in mechanically highly loaded components requiring reliable electrical or thermal conductivity.
PLASTIC INJECTION MOULDS | ELECTRODES | RESISTANCE WELDING | NON-MAGNETIC SPARK FREE TOOLS
Key Features
Highest hardness and tensile strength among low-alloy copper materials
High electrical and thermal conductivity
High thermal stability at elevated temperatures
Very high creep resistance
Suitable for mould making applications involving abrasive plastics
Chemical Composition nominal
Deviations may occur to achieve specific product characteristics.
Co COBALT | Ni NICKEL | Be BERYLLIUM | Co+Ni+Fe | Cu COPPER |
min. 0.2 | 1.9 | max. 0.6 | balance | |
EN | DIN | UNS | RWMA |
CW101C | 2.1247 | C17200 | Class 4 |
Typical Application
Plastic Injection Moulds
Resistance Welding
Typical Components
Highly loaded components for flash butt and projection welding
Spark-free and non-magnetic manual tools
Mould inserts, cooling plates and cooling pins
Physical and Mechanical Properties nominal
|
| FORGED | EXTRUDED |
Tensile strength Rm | (MPa) | 1120 | 1305 |
Yield strength RP0.2 | (MPa) | 990 | 1008 |
Brinell hardness | (10/3000) | 360 | 375 |
Elongation A5 | (%) | 5 | 4 |
Elasticity modulus E | (GPa) | 128 | 135 |
Density ρ | (g/cm³) | 8.3 |
|
Thermal conductivity λ- 20°C | (W/m.K) | 104 |
|
Electrical conductivity- 20°C | (% I.A.C.S.) | 24 |
|
Electrical conductivity | (m/W*mm2) | 16 |
|
Coefficient of thermal expansion α | (10-6/K) | 17.5 |
|
The values provided are based on experience gained from production facilities, material manufacturers and our own investigations. They may vary due to production- and batch-related influences and therefore do not constitute a guarantee or a warranted property. For the evaluation of specific applications, we are pleased to provide support upon request. Binding statements or commitments are issued exclusively in written form by our technical team. Rev. 02/2026
